JPH0445986B2 - - Google Patents
Info
- Publication number
- JPH0445986B2 JPH0445986B2 JP23464387A JP23464387A JPH0445986B2 JP H0445986 B2 JPH0445986 B2 JP H0445986B2 JP 23464387 A JP23464387 A JP 23464387A JP 23464387 A JP23464387 A JP 23464387A JP H0445986 B2 JPH0445986 B2 JP H0445986B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead frame
- circuit
- hole
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 69
- 239000004020 conductor Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23464387A JPS6476747A (en) | 1987-09-17 | 1987-09-17 | Semiconductor mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23464387A JPS6476747A (en) | 1987-09-17 | 1987-09-17 | Semiconductor mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6476747A JPS6476747A (en) | 1989-03-22 |
| JPH0445986B2 true JPH0445986B2 (en]) | 1992-07-28 |
Family
ID=16974239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23464387A Granted JPS6476747A (en) | 1987-09-17 | 1987-09-17 | Semiconductor mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6476747A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2676112B2 (ja) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| EP0496491A1 (en) * | 1991-01-22 | 1992-07-29 | National Semiconductor Corporation | Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same |
-
1987
- 1987-09-17 JP JP23464387A patent/JPS6476747A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6476747A (en) | 1989-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5710064A (en) | Method for manufacturing a semiconductor package | |
| US4806409A (en) | Process for providing an improved electroplated tape automated bonding tape and the product produced thereby | |
| EP0213575A2 (en) | Method of manufacturing a semiconductor device employing a film carrier tape | |
| KR0185570B1 (ko) | 칩 스케일 패키지의 제조 방법 | |
| JP2000150702A (ja) | 半導体装置の製造方法 | |
| JPH0922963A (ja) | 半導体回路素子搭載基板フレームの製造方法 | |
| JP3420706B2 (ja) | 半導体装置、半導体装置の製造方法、回路基板、回路基板の製造方法 | |
| JPH11176885A (ja) | 半導体装置及びその製造方法、フィルムキャリアテープ、回路基板並びに電子機器 | |
| US6101098A (en) | Structure and method for mounting an electric part | |
| KR20010062371A (ko) | 리드 프레임 및 그 제조방법과, 반도체 디바이스 및 그제조방법 | |
| US20010022391A1 (en) | Substrate for semiconductor device and semiconductor device fabrication using the same | |
| JPH0445986B2 (en]) | ||
| JPH1070211A (ja) | テープキャリア及びその製造方法 | |
| JP2652222B2 (ja) | 電子部品搭載用基板 | |
| JPH02252251A (ja) | フィルムキャリヤーテープ | |
| JP3383597B2 (ja) | 半導体装置の製造方法 | |
| JP2840293B2 (ja) | Ｔａｂ用テープ及びこれを用いた半導体装置 | |
| JPH07201928A (ja) | フィルムキャリア及び半導体装置 | |
| JP2573207B2 (ja) | 表面実装部品用パツケ−ジ | |
| JP2782374B2 (ja) | 電子部品搭載装置及びその製造方法 | |
| JPH1022412A (ja) | ボールグリッドアレイ型回路基板 | |
| JPH11233566A (ja) | 半導体装置用配線パターンフィルム | |
| JPH05259214A (ja) | 半導体装置 | |
| JPH04354355A (ja) | チップキャリヤ | |
| JPH09172037A (ja) | 半導体装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080728 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080728 Year of fee payment: 16 |